工艺能力主要SMT生产线由日本松下、三星、日本的自动化高精度先进设备组成，共6条生产线（SMT元器件最小尺寸可达0201，可实现0.6mm*0.3mm~50mm*50mmQFP，0.15mm间隙，±0.05精度），EMS的生产能力可以达到每月150000000个部件。
我们的工程团队在DFM/DFA/DFT技术方面拥有丰富的经验。
SMT、BGA返工、再成球、X光等都是很容易实现的。模板可以
在4小时内切割并交付。
Process Capability | | | | | | | |
| | | | | | | | | |
porject | batch（mm） | Model，small
quantities（mm） | SMT
placement
component
specificatio
ns | Dimensions | Minimu
m
specificat
ions | 0603（0201） | 0402（01005） |
biggest
size | 45*45 | 45*45
≤68*68（45*150） |
The job
specificati
on
SMT PCB | L*W | Least | 50*30 | L<50 Or W<30 |
Max | 450*350 | 800≥L>450
Or 400≥L>350 | Compon
ent
thickness | 25.4 | T>25.4 |
thickness
T | Thinnest | 0.8 | T<0.8 | QFP/SOP/SO
J/IC
/Strips etc. | Least PIN
spacing | Pitch=0.4 | Pitch=0.3 |
Thickest | 5 | T>5 |
DIP job of
PCB
specificati
on | L*W | Least | 50*30 | L<50 | CSP,BGA | Minimu
m ball | Pitch=0.5 | 0.3≤Pitch<0.5 |
Max | 500*300 | 1000≥L>500
Or 450≥W>300 | PCB Process | | | Common FR4，FPC,Rigid-flex
board metal plate |
thickness
T | Thinnest | 0.8 | T<0.8 | | | | | |
Thickest | 5 | T>5 | | | | | |
| | | | | | | | | |
Delivery Capablilty | | | | | |
| | | | | | | | | |
Types of | Model，small quantities | Types of | Model，small quantities |
100 lever or less | 101-1000 sheet | 1000 more | 100 lever or less | 101-1000 sheet | 1000 more |
Delivery | After 2-3 days post | After 3-4 days
post | 3 days form the
cross，
quantitative daily
shipments
according to
customer
demand | Delivery | After 2-3 days
post | 3 days from
delivery，
five days paid
the | 3 days form the cross
quantitative daily
shipments
according to customer
demand |
Remark | Product delivery pass rate：99.99%
Product delivery information，materials confirming
that no abnormal start
start count | Remark | Product delivery pass rate：99.99%
Product delivery information，materials confirming
that no abnormal start
start count |
